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Evonik develops a new debonding-on-demand technology for sustainable adhesive solutions
Evonik is introducing an adhesive concept that can be peeled off substrates on demand, making recycling and repairs easier. The new technology uses cleavable covalent bonds and should integrate seamlessly into existing manufacturing processes.
Evonik has introduced a new debonding-on-demand process designed to promote a circular economy in the production of composite materials and bonded components. The concept was developed jointly by the strategic innovation unit Creavis and the Comfort & Insulation business unit. The focus is on an adhesive system that can be detached from substrates by targeted heat treatment (between 80 and 150°C) – without damaging the components. This enables both repair and recycling of unmixed materials.
The innovation is based on chemical networks with cleavable, reversible covalent bonds. This allows the adhesive to lose its cohesion as needed. Initial tests show that both single-component and two-component polyurethane adhesives can be detached significantly more easily – a decisive advantage for applications in which previous systems have reached their limits.
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Integration into existing processes possible
The new technology is characterised by low viscosity and broad applicability. It can be easily integrated into existing manufacturing processes and thus complements established debonding methods such as stretch-and-detach or electrical debonding systems. Dr Christian Brandl, Technology Manager at Evonik, emphasises the regulatory relevance: The system is a response to increasing demands in the areas of sustainability, material recovery, and resource efficiency.
According to Evonik, the development is currently in the demonstration phase. Initial market tests with industrial partners are already underway to evaluate the potential for series production. The company sees the concept as a future-oriented building block for designing recyclable products in the adhesives market.
