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Flexible epoxy resins withstand extreme cold
Two newly developed epoxy curing agents enable an unprecedented combination of flexibility, cryogenic resistance and electrical stability. This research may pave the way for advanced applications in sensor technology and electronics under extreme conditions.
A Chinese research team has introduced two novel epoxy curing agents designed to overcome the typical limitations of conventional systems—namely brittleness and poor low-temperature performance. The two approaches involve a silane-modified agent (DETA-Si) and a flexible-chain-engineered agent (NBOn).
The DETA-Si/epoxy formulation achieves an elongation at break of 125 %, representing a 22-fold increase over unmodified systems. At the same time, the dielectric loss remains very low (tan δ < 0.04) and the thermal decomposition temperature reaches 236 °C. The NBOn series combines rigid benzene rings with tunable aliphatic chains to deliver excellent cryogenic performance: after 24 hours in liquid nitrogen (77 K), more than 50 % of ductility is retained at 298 K.
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Mechanical and electrical synergies under extreme conditions
Epoxy composites cured with NBOn also demonstrate stable electrical resistance, with deviations of less than ±5 % over 30 days of cryogenic exposure. According to the authors, the key to this performance lies in free volume engineering, as validated using Williams–Landel–Ferry (WLF) modelling.
These formulations offer new perspectives for the development of flexible electronics, sensors and other devices that must operate reliably in polar climates or other low-temperature environments. The work presents a promising foundation for next-generation functional coatings that combine high mechanical durability with electrical reliability—even under extreme thermal stress.
Source: Polymer Chemistry, Issue 24, 2025, Royal Society of Chemistry
