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Monday, 23 September 2019
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Raw materials & technologies, Technologies, Nanotechnology

Preparing stable conductive inks with Copper nanoparticles

Tuesday, 20 May 2014

Conductive ink with Copper nanoparticles (Cu NPs), has various advantages compared with conventional ink, such as good electrical conductivity and low cost.

Preventing copper nanoparticles from oxidation was investigated Source: David Hughes-Fotolia.com

Preventing copper nanoparticles from oxidation was investigated Source: David Hughes-Fotolia.com

However, it suffers through easily oxidisation problem, leading to an unstable electrical conductivity, which decreases over time. Therefore, it is important to prevent (or least minimize) oxidation of the Cu NPs.

Coating conditions were varied

In this study, 50-nm-diameter Cu NPs were coated with 1-octanethiol (CH3(CH2)7SH) in a high-vacuum condition (5.33 × 10−4 Pa). The coating conditions were systematically varied to investigate the effect on the coating thicknesses. Coated Cu NPs were dispersed in 1-octanol to form the conductive ink, and the dispersion behaviour was studied as a function of the thickness of the 1-octanethiol coating. The thickness of the coating layer was characterised using transmission electron microscopy and X-ray spectroscopy analysis, and was found to be 3 nm, 6 nm, and 10 nm. The dispersion stability of the inks was characterised by Turbiscan dispersion stability and viscosity measurements, and it was found that the copper nanoink formed using Cu NPs with a 6-nm-thick coating exhibited the most stable dispersion properties.

The study is published in: Applied Surface Science.

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