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Thursday, 19 September 2019
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Raw materials & technologies, Raw materials

Phosphorylation improves moisture resistance of soy flour based adhesive

Thursday, 10 April 2014

A green-chemistry approach to improve the moisture resistance of soy flour (SF)-based wood adhesive is described by American researchers.

Soy-flour increases the wet bond of adhesives Source: Pefkos Victor Burnside-Fotolia.com

Soy-flour increases the wet bond of adhesives Source: Pefkos Victor Burnside-Fotolia.com

Chemical phosphorylation of SF (PSF), using POCl3 as the phosphorylating agent, dramatically increased its wet bond strength. The optimum POCl3:SF ratio that produced maximum wet bond strength was about 0.15 (g g−1). The increase in wet bond strength of PSF (PSF0.15) was mostly due to the phosphate groups incorporated into the proteins and carbohydrates, and to a lesser degree to phosphorylation-induced protein denaturation.

Phosphate groups acted as cross-linking agents

The attached phosphate groups acted as cross-linking agents, either via covalent esterification with hydroxyl groups on wood chips or via ionic and hydrogen-bonding interactions with functional groups in wood chips. At hot-press temperatures above 160°C the wet bond strength of PSF0.15 was >2.6MPa, a level that might be acceptable for interior-used hardwood plywood and particleboard. POCl3 is a low cost, general-purpose reagent and therefore PSF-based adhesive is expected to be environmentally friendly.

The study is published in: Journal of Applied Polymer Science, Volume 131, Issue 13, 5 July 2014.

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