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Friday, 20 September 2019
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Raw materials & technologies, Raw materials, Coatings binders

Modelling of ambient temperature curing epoxy resins

Thursday, 17 January 2013

A cure kinetics and rheology model enables the improvement of resin infusion and wet layup processes by providing a thorough understanding of the interlinked relationship between time, temperature, degree of cure and viscosity.

Model for cure kinetics and rheology characterisation of ambient temperature curing epoxy resins has been developed / Source: Fotolia

Model for cure kinetics and rheology characterisation of ambient temperature curing epoxy resins has been developed / Source: Fotolia

To date, the characterisation of ambient curing epoxy resins has been limited to relatively simple measures, not suitable for use in heat transfer and flow process models. C.M.D. Hickey and S. Bickerton from the University of Auckland, New Zealand, developed a complete cure kinetics and rheology model. This model allows the prediction of the progression of degree of cure and viscosity for any time-temperature history. The progression of degree of cure of two epoxy resin systems was measured by differential scanning calorimeter and fitted to an nth order model incorporating vitrification effects. Viscosity was measured using an oscillatory rheometer and fitted to a model from the literature.

Read the complete study "Cure kinetics and rheology characterisation and modelling of ambient temperature curing epoxy resins for resin infusion/VARTM and wet layup applications” in the Journal of Materials Science, Vol. 48, Issue 2, 2013, pp. 690-701.

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