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Sunday, 22 September 2019
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Raw materials & technologies, Applications

Low-temperature sintering highly conductive silver ink for flexible electronics

Tuesday, 16 August 2016

A team of reserchers report a naive synthesis procedure for development of a durable, particle-free and low-temperature sintering silver organic precursor (SOP) ink by using low boiling-point mild organic complexing ligands.

Example of a flexible-circuit film. Source: Patrick Mansell/PennState

Example of a flexible-circuit film. Source: Patrick Mansell/PennState

The synthesised inks were printed on variable substrates such as glass, PET and PI by spin-coating and nozzle-jet printing methods.

Excellent adhesion and high conductivity

As-printed films were sintered at low temperatures (<90 °C) to achieve smooth silver films having excellent adhesion and high conductivity. The SOP spin-coated film on glass annealed at 60 °C and the nozzle-jet printed film on PET sintered at 75 °C yielded high conductivities of 1.07×106 S/m and 2.74×106 S/m, respectively, which are only one-order-of-magnitude lower than bulk silver (~107 S/m). The silver films connected with light-emitting diodes (LEDs) also showed excellent adhesion strength through bending and twisting test.

The study is published in: Journal of Materials Chemistry C.

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