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Sunday, 19 May 2019
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Markets & companies, Coatings market

Radiation curing: RadTech and Pira to collaborate on market study

Wednesday, 26 January 2011

Pira International and RadTech Europe have agreed to work together on a new market study named "The Future of Radiation Curing for Packaging.”

Pira International and RadTech Europe have agreed to work together on a new market study named "The Future of Radiation Curing for Packaging." The study will kick off in early 2011 with a final publication date in the summer of 2011. The study will provide quantitative market sizes for each key material, end-use, region and country. Using extensive primary research, the study will forecast to 2016. In addition, the study will contain important chapters on technology innovations and forecasts, key drivers and hot topics such as sustainability.

Pira and RadTech will release market study named "The Future of Radiation Curing for Packaging", which includes chapters on technology innovations and forecasts, key drivers as well as hot topicssuch as sustainability. Source: H.-Hoppe/Pixelio.de
Pira and RadTech will release market study named "The Future of Radiation Curing for Packaging", which includes chapters on technology in...
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