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Friday, 18 April 2014
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Raw Materials & Technologies, Technologies, UV/EB

EB curable CI-flexo ink technology provides sustainable printing solutions

Monday, 12 March 2012

New printing process has been proven to be stable for high speed package printing industrial applications.

The new addresses  high speed package printing industrial applications

Source: Miroslaw/Pixelio.de

The new addresses  high speed package printing industrial applications

Source: Miroslaw/Pixelio.de

New EB CI-flexo ink technology has been developed to permit wet trapping without interstation hot air drying. This ink technology uses electron beam initiated free radical polymerisation to achieve cure, and wet trapping is obtained by organo-jellification mechanism using Hansen Solubility Parameters (HSP). This patent pending new printing process was developed over two years and has been proven to be stable for high speed package printing industrial applications. It provides high resolution printing up to 70 lcm with the lowest carbon foot print compared to incumbent curing technologies used in CI-flexo printing. Rob Schellekens of Technosolutions, Brasil, will present this new technology at the European Coatings Symposium "Novel developments for printing inks” on 15 May, 2012, in Berlin. 

Learn more about the symposium

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